RiLOCK™ W325 is a proprietary additive engineered to reduce peak exotherm temperatures in RiLOCK™ systems during curing. Its optimized particle size distribution and high thermal mass act as an effective heat sink, dissipating heat uniformly throughout the mix and mitigating the risk of thermal runaway or thermal instability. RiLOCK™ W325 integrates seamlessly into RiLOCK™ Resin formulations and can also be used to increase density of the resin system.
APPLICATIONS & BENEFITS
FEATURES & ADVANTAGES
APPLICATIONS & BENEFITS
Reduces peak exotherm temperatures to prevent thermal runaway
Enhances safety and reliability in high-mass applications
Maintains stability and adhesion performance
Supports consistent, predictable mixing and curing in demanding field conditions